IMPORTANT DEADLINES

• Due date for peer-reviewed abstracts for published proceedings ..........................................................March 1, 2009

• Due date for peer-reviewed technical papers for published proceedings..........................................March 16, 2009

• Due date for minisymposium proposals ............................................................................................................May 15, 2009

• Due date for abstracts of all contributed and minisymposium presentations......................................May 15, 2009

ORGANIZING COMMITTEE General Chairs

Daniel Gonsor, The Boeing Company William Regli, Drexel University

General Co-Chairs

Thomas Grandine, The Boeing Company Jan Vandenbrande, The Boeing Company

Honorary Chairs

George Allen, Siemens PLM Software Michael Wozny, Rensselaer Polytechnic Institute

Program Chairs

Wim Bronsvoort, Delft University of Technology,

The Netherlands

Jens Gravesen, Technical University of Denmark, Denmark John Keyser, Texas A&M University

Instructions on how to participate and more at

www.siam.org/meetings/gdspm09/

acm

3600 Market Street, 6th Floor Philadelphia, PA 19104-2688 USA www.siam.org

THEMES

Applications

• Computer-aided design, engineering, and manufacturing

• Robotics

• Computer graphics, visualization, and animation

• Virtual environments and prototypes

• Computer vision and image processing

• Biomedical and biochemical applications

• Geophysical applications

• Digital entertainment applications

Topics

• Algebraic and differential geometry

• Computational geometry and topology

• Curves and surfaces

• Geometric and topological representations

• Heterogeneous models for physical objects and properties

• Geometry generation, processing, compression, and transmission

• Reconstruction of surfaces and solids from discrete data

• Shape modeling, synthesis, and analysis

• Geometric constraint solving

• Physics-based modeling

• Conceptual design

• Product and assembly modeling

• Feature modeling and recognition

• Dimensioning and tolerancing

• Simulation and optimization

• Product data exchange, standards, and interoperability

• Collaborative and distributed design

• Haptic and other user interfaces for 3D design